Equivalent circuits for electromigration
نویسندگان
چکیده
منابع مشابه
Electromigration in Interconnect Structures of Microelectronics Circuits
We present a comprehensive physical model for the whole life cycles of electromigration induced voids. Special emphasis is put on explaining the void morphology and its impact on interconnect resistance. Investigations for common twoand three-dimensional interconnect structures are presented. Implications of the theoretical analysis and the simulation results for modern interconnect design are ...
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ژورنال
عنوان ژورنال: Microelectronics Reliability
سال: 2021
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2021.114200